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SHENZHEN DIBI TECHNOLOGY CO.,LIMITED
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printed circuit board
Specification: 25*25
Detail: Process description: Layer: 16 Materials: FR4 Thickness of plating:1.6mm Surface treatment: lead-free tin-leveled The minimum via: 0.075mm(3mil) The minimum line width: 0.075mm(3mil) The minimum distance line: 0.075mm(3...
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Tel : 86 755 29459919 Fax : 86 755 29459989
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